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    • Survey of semiconductor wafer defect detection method based on machine vision

    • The development of integrated circuit technology cannot be separated from semiconductor wafers, and defect detection is crucial to ensure chip performance. This article summarizes the research progress of wafer defect detection methods, providing solutions for improving wafer yield and productivity.
    • Vol. 30, Issue 1, Pages: 25-50(2025)   

      Received:01 February 2024

      Revised:29 April 2024

      Published:16 January 2025

    • DOI: 10.11834/jig.240053     

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  • Hu Zhiqiang, Wu Yiquan. 2025. Survey of semiconductor wafer defect detection method based on machine vision. Journal of Image and Graphics, 30(01):0025-0050 DOI: 10.11834/jig.240053.
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相关作者

Dong Yongfeng 河北工业大学人工智能与数据科学学院;河北省大数据计算重点实验室(河北工业大学);河北省数据驱动工业智能工程研究中心(河北工业大学)
Li Jiawei 河北工业大学人工智能与数据科学学院;河北省大数据计算重点实验室(河北工业大学);河北省数据驱动工业智能工程研究中心(河北工业大学)
Wang Zhen 河北工业大学人工智能与数据科学学院;河北省大数据计算重点实验室(河北工业大学);河北省数据驱动工业智能工程研究中心(河北工业大学)
Jia Wenyu 河北工业大学人工智能与数据科学学院;河北省大数据计算重点实验室(河北工业大学);河北省数据驱动工业智能工程研究中心(河北工业大学)
Lin Siyuan 南京航空航天大学电子信息工程学院
Chai Jingwen 武汉大学电子信息学院
Li Ankang 武汉大学电子信息学院
Zhang Hao 武汉大学电子信息学院

相关机构

Hebei Province Key Laboratory of Big Data Computing(Hebei University of Technology)
School of Artificial Intelligence, Hebei University of Technology
Hebei Engineering Research Center of Data-Driven Industrial Intelligent(Hebei University of Technology)
School of Electronic Information, Wuhan University
Jiangxi Institute of Interest of Things Industry Technology
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